The module we have chosen will be static. It will only provide us with the ability to configure our product designs according to its specification. If we require, for instance, to change the PCM interface to utilize a more price-conscious or better performing codec, we will require access to the Bluetooth chip/chip set that the module is based upon to reconfigure it. If this could affect your product, then ensure that this reconfigure option is available from the module you choose.
Developing & Deploying...
Obtaining Bluetooth Technology Qualification
In order to obtain qualification of a component or product, the manufacturer may use a test house for two services:
■ The test house is contracted to make tests to a Bluetooth test specification, and to produce a test report containing the results of the tests.
■ An employee of the test house who is appointed by the Bluetooth SIG as a Bluetooth Qualification Body (BQB) reviews evidence submitted by the manufacturer in a Compliance Folder (CF), and if satisfactory, the BQB submits the product or component to the Bluetooth Qualification Administrator (BQA) for listing on the Bluetooth Qualified Products List (BQPL).
A Bluetooth component is an implementation that contains some Bluetooth functionality, and which can be included into another component or product. It can be prequalified so that components or products containing the component do not have to be tested for the prequalified functionality. A Bluetooth product or end product is a device to be sold to the end user, and it can be made up of prequalified components to reduce the testing required by the product manufacturer.
The list that follows gives more details on the tests necessary for qualification:
■ RF Tests are required to be made once for each new PCB design. If the same pretested module is reused in other end equipment, no tests need to be repeated.
■ USB, UART, or BCSP variants should not need to be retested for RF as the HCI does not affect radio performance. PCB variants where all RF layout and components are identical should not need to be tested, subject to agreement with the BQB.
■ The Bluetooth Qualification Body (BQB) may require one or more BB timing tests to be repeated for each new PCB design. This may not be necessary if the crystal is the same as used by the qualified component. If extra testing is required, one timing test needs to be tested at extreme conditions.
(Currently these tests can be performed by manufacturers using standard test equipment. In the future, there are plans to move this testing into test facilities.)
■ Both Module manufacturers and end product users can use a software component that is prequalified at baseband (BB) and LM.
■ If the new design includes the upper layer stack components HCI, L2CAP, RFCOMM, Service Discovery Protocol (SDP), or Bluetooth Profiles, these must also be qualified.
■ Software components affecting profiles must be qualified. This could be done by developing and qualifying your own profile software components, or by buying in prequalified profile software components and integrating them into the end product.
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